Hunan San'an Semiconductor

16 Billion

Total Investment
980 Mu

Land Area
600+

Invention Patents
800+

Global Customers

Project Overview

Founded in July 2020, Hunan San'an Semiconductor Co., Ltd. is a wholly-owned subsidiary of Sanan Optoelectronics. Since its establishment, the company has been listed as one of Hunan Province’s Top 10 Key Projects. It focuses on silicon carbide (SiC) and gallium nitride (GaN) power semiconductors, undertaking the core strategic layout in third-generation wide-bandgap semiconductors. We strive to build a world-leading vertically integrated manufacturing and service platform covering the full SiC & GaN industrial chain. Driven by ""technology leadership + ecological empowerment"", the company has established an internationally advanced production capacity system through large-scale deployment of a thousand-mu industrial park in Changsha (supporting 6-inch and 8-inch wafer fabrication), as well as an 8-inch substrate and wafer manufacturing base jointly built with STMicroelectronics in Chongqing.

Through deepened industry-university-research cooperation and global strategic joint ventures, we have served more than 800 global customers including Li Auto, Sungrow Power Supply, Sungrow E-Drive, SAMSUNG, VALEO, Vertiv, etc. Cumulative chip shipments have reached 400 million pieces. Our products are widely applied in new energy vehicles, photovoltaics, charging piles, industrial power supplies, AI servers, AR glasses, humanoid robots, white goods and other key sectors.

Thanks to outstanding achievements, the company has been awarded multiple authoritative honors including National High-tech Enterprise, National Single Champion in Manufacturing, Hunan Provincial Specialized, Refined, Distinctive & Innovative SME, and Green Factory.

Looking ahead, adhering to the mission of "Leading Chip Innovation, Empowering New Energy", Hunan Sanan will continuously increase R&D investment to accelerate large-scale commercialization of SiC/GaN technologies in energy electronics. We aim to evolve into a world-class full-chain manufacturing and service platform for wide-bandgap semiconductors, delivering chip power for a low-carbon global future.

Core Advantages

The world’s third and China’s first vertically integrated manufacturing platform for 6-inch & 8-inch third-gen semiconductor SiC power chips.

Manufacturing Strength

Hunan Sanan operates a vertically integrated manufacturing platform for SiC power chips, featuring a thousand-mu super SiC fab with mass production capacity for 6-inch and 8-inch wafers. Our automotive-grade products have passed authoritative certifications with robust mass delivery capability.
R&D & Technology

Hunan Sanan has conquered full-chain core technologies of SiC, ranging from crystal growth & substrate manufacturing, epitaxy to chip design and fabrication. We took the lead in deploying core processes for 8-inch wafers, with material and device performance reaching internationally advanced standards. Our technologies are highly compatible with high-end scenarios such as automotive-grade applications, new energy and AR optics, building solid technical barriers in wide-bandgap semiconductors via independent core R&D.
Product Advantages

Hunan Sanan has built a core product portfolio characterized by cutting-edge technology, automotive-grade quality, mature mass production and full supply chain independence. Covering 8-inch SiC materials to automotive-grade power devices, our products match international benchmarks in key indicators. Core components are certified to AEC-Q101 automotive standards, featuring low power loss, high reliability and cost-effectiveness. Our products serve diverse markets including new energy vehicles, photovoltaic energy storage, AI servers and AR optics, supported by stable production capacity and fast order fulfillment.