Hubei Aimp

A leader in the industrialization of new Micro LED display devices

Hubei Aimp Optoelectronics was founded on September 24, 2021, as a wholly-owned subsidiary of Sanan Optoelectronics. Adopting the dual-drive core strategy of ""devices plus panels"", it focuses on the mass production of high-end Micro LED display devices and integrated panels, and builds an independent and controllable industrial system covering chips, packaging and panels. The company has launched the Micro-MiP series of high-performance display devices and panel products, which are widely used in high-end commercial displays, command and dispatch centers, virtual shooting, premium cinemas, smart meeting rooms and other scenarios. Featuring high brightness, high reliability and fine pixel pitch, it provides customers with one-stop panel delivery solutions.

Aimp Optoelectronics keeps deepening technological innovation and industrial implementation of Micro LED, and continuously upgrades its products and production capacity. It aims to become a global leader in the industrialization of new Micro LED display devices and drive high-quality development of the high-end display industry.

Core Advantages

A pioneer across the entire Micro LED industrial chain. Powered by the original AM-MiP technology and large-scale mass production, we empower a new ecosystem for high-end display.

Adopting mass transfer technology for high production efficiency.

The MiP (Micro) products adopt mass transfer technology, with an UPH ranging from 13,000,000 to 120,000,000 units per hour, 200 to 2000 times faster than conventional transfer methods. The positioning accuracy reaches ±1 micrometer, 15 times that of traditional equipment, and the transfer yield stands at 99.99%. Currently, Aimapu applies stamp-based mass transfer technology. Going forward, we will adopt a combined laser and stamp solution to further boost production efficiency.
Adopting advanced chip-level packaging technology with high reliability.

The MiP (Micro) products adopt advanced chip-level packaging technology. Black glue is applied around the chips via the BM process, and electrode expansion is realized through the RDL process. Finally, the circuits are protected with PV material. This process integrates Micro LED chips with sapphire substrates and pads as a whole, greatly enhancing air tightness, ensuring high reliability and reducing the occurrence of the "caterpillar defect".
Wide viewing angle with no color shift at large viewing angles.

"Wide Viewing Angle: The chip thickness is less than 10μm, and the perimeter is enclosed by black glue dams. This enables upward light emission from the chips, and the light is refracted by sapphire to achieve a viewing angle over 175°. Excellent Light Mixing: The Micro chips feature a tiny footprint. The RGB chips inside each MiP lamp bead are placed extremely close to one another, delivering superior light mixing at each pixel and more lifelike colors. No Light Crosstalk & No Color Shift: The dedicated MiP packaging structure ensures upward light emission and effectively eliminates pixel light crosstalk. All chip light-emitting surfaces lie on the same plane without mutual light blocking, resulting in zero color shift across all viewing angles for a full 360° viewing experience. It performs exceptionally well in virtual shooting and irregular-shaped products."
Micro-MiP Device

Micro-MiP0101, Micro-MiP0202, AM-MiP0303 Adopts mass transfer technology for high production efficiency Features advanced chip-level packaging for superior reliability Equipped with intelligent AI arrangement for excellent color consistency High die bonding yield
Micro-MiP Display Panel

Series A (Active Drive Version): P0.39-P1.9 Series M (Professional Version): P0.62-P1.25 Series P (Standard Version): P0.78-P1.56 Ultra-wide viewing angle, high contrast ratio, high brightness and high refresh rate.